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Boron evaporation and related difficulties

M. Z. BALBAG1, S. PAT1, M. I. CENIK1, T. AKAN1, N. EKEM1,* , G. MUSA2

Affiliation

  1. Eskisehir Osmangazi University, Physics Department, Eskisehir, Türkiye
  2. Ovidius University, Physics Department, Constanta, Romania

Abstract

Boron is one of the materials of interest for the coming years. Used up to now as compounds element in a large number of chemicals or drugs, a growing interest for boron in order to be used as an element (atom) or simple diatomic compound (like boron carbide) can be observed. If we consider boron from its melting point of view, we can observe that boron is close to the refractory metals. Indeed, boron has a melting point of 2300oC, other materials with higher melting points being Niobium (2468oC), Molybdenum (2617oC), Tantalum (2996oC), Rhenium (3180oC), Tungsten (3407oC) and Carbon (3550oC). Boron coating is one of the technologies recently considered to be of special interest due to the qualities of boron. The aim of this paper is to present the related difficulties of the evaporation of boron using Thermionic Vacuum Arc (TVA) Technology..

Keywords

Boron, Evaporation of boron, Thermoionic Vacuum Arc (TVA), Boron deposition.

Submitted at: Nov. 2, 2006
Accepted at: April 15, 2007

Citation

M. Z. BALBAG, S. PAT, M. I. CENIK, T. AKAN, N. EKEM, G. MUSA, Boron evaporation and related difficulties, Journal of Optoelectronics and Advanced Materials Vol. 9, Iss. 4, pp. 858-861 (2007)