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Current trends in research and development of tensoresistive sensors

LEILA ZEVRI1,* , IULIAN IORDACHE1,2

Affiliation

  1. Valahia University from Târgovişte, Bd. Carol I, Nr. 2, 130024, Târgovişte, Dâmboviţa, Romania
  2. National Institute for Research in Electrical Engineering (INCDIE ICPE-CA), Splaiul Unirii, No. 313, Sector 3, 030138, Bucharest, Romania

Abstract

Pressure and strain measurements, evaluation of the mechanical load conditions are a special chapter of the materials science and engineering and the distinctive domain of sensors. This paper focuses on some of the current trends on research and development of the piezoresistive/tensoresistive sensors. Tensoresistive sensors are gaining renewed interest as the level of sophistication in the application of minimum invasive surgery and humanoid robots increases. The new application domains require versatile, autonomous, intelligent robots. Touch detection information can be used to determine if the robot is in contact with an object, which is the contact configuration, grasping, as well as stability and feedback, to control the robot force. MEMS tactile sensors include piezo-resistive, capacitive, piezoelectric and optical types. Because they are easy to manufacture and they have a low production cost the piezo-resistive sensors are widely used. Due to difficulties of applications of tactile sensors on a rigid body, recent reports have focused on MEMS tactile sensors based on polymers. Conducting polymers has excellent electrical, chemical and mechanical properties and they are useful for designing efficient, versatile and real-time response for different sensor applications. A frequent choice of pressure sensitive materials is elastomers that are enriched with conductive filler particles..

Keywords

Conducting polymers, Tactile sensors, Resistive force sensors.

Submitted at: Aug. 1, 2013
Accepted at: Jan. 22, 2014

Citation

LEILA ZEVRI, IULIAN IORDACHE, Current trends in research and development of tensoresistive sensors, Journal of Optoelectronics and Advanced Materials Vol. 16, Iss. 1-2, pp. 52-59 (2014)