"

Cookies ussage consent

Our site saves small pieces of text information (cookies) on your device in order to deliver better content and for statistical purposes. You can disable the usage of cookies by changing the settings of your browser. By browsing our site without changing the browser settings you grant us permission to store that information on your device.

I agree, do not show this message again.

Effect of over-potential on the surface morphology of electrodeposited copper micro-cylinders

S. KUMAR1,* , S. K. CHAKARVARTI2

Affiliation

  1. Department of Applied Physics, University College of Engineering, Punjabi University, Patiala – 147002, India
  2. Department of Applied Physics, National Institute of Technology (Deemed University), Kurukshetra - 136119, India

Abstract

60 μm thick polycarbonate foils were irradiated to 208Pb ions (energy~11.6 MeV/n, flux~106 ions/cm2). Irradiated polycarbonate foils were chemically etched in 6N NaOH solution at 60 °C for 35 minutes. Aligned copper microstructure bunches have been electrodeposited in porous polycarbonate templates from acidic copper sulphate solution at 30°C. Copper microstructures with uniform diameter ~ 3 μm and length ~ 50 μm were obtained, which corresponds to the pore sizes of the templates used. Effect of over-potential on the surface morphology of electrodeposited micro-cylinders was also observed..

Keywords

Microstructure, Electrodeposition, Template synthesis, Ion track membranes.

Submitted at: Feb. 28, 2007
Accepted at: Aug. 18, 2007

Citation

S. KUMAR, S. K. CHAKARVARTI, Effect of over-potential on the surface morphology of electrodeposited copper micro-cylinders, Journal of Optoelectronics and Advanced Materials Vol. 9, Iss. 8, pp. 2521-2523 (2007)