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Elastic thermoelectric cells based on rubber, graphene and p-Bi2Te3 composites, fabricated by rubbing-in technology

KH. S. KARIMOV1,2, M. SALEEM3,* , N. FATIMA4, R. ALI1

Affiliation

  1. GIK Institute of Engineering Sciences and Technology, Topi, District Swabi, KPK, 23640, Pakistan
  2. Center for Innovative Development of Science and New Technologies of Academy of Sciences of Tajikistan, Dushanbe, 734025, Rudaki 33, Tajikistan
  3. Government Graduate College(B), GulbergLahore, 54000, Pakistan
  4. Solar Energy Research Institute, The National University of Malaysia, 43600 Bangi, Selangor, Malaysia

Abstract

The rubber, graphene and p-Bi2Te3 composite thermoelectric cells are fabricated and their properties are investigated. The cells were fabricated by deposition of the graphene nano powder and p-Bi2Te3 powder on the surface of porous rubber by use of rubbing-in technology. It was observed that Seebeck coefficient of the rubber and graphene composite decreased with increase of temperature, but in the case of the rubber, graphene and p-Bi2Te3composite,it was increased. The output thermoelectric voltages of both composites increased with increase of the gradient of temperature. The thermoelectric voltage generated by the cell, fabricated from rubber and graphene composite was lower, at the same gradient of temperature, than that of the composite based on rubber, graphene and p-Bi2Te3. The rubbing-in technology can be used for the fabrication of the thermoelectric devices for demonstrative purpose. The obtained results may be used for the development of the flexible thermoelectric cells technology. The used technology for the cell’s fabrication is simple and low cost..

Keywords

Rubber, Graphene,p-Bi2Te3, Seebeck coefficient, Temperature gradient, Flexible substrate.

Submitted at: March 27, 2020
Accepted at: June 11, 2021

Citation

KH. S. KARIMOV, M. SALEEM, N. FATIMA, R. ALI, Elastic thermoelectric cells based on rubber, graphene and p-Bi2Te3 composites, fabricated by rubbing-in technology, Journal of Optoelectronics and Advanced Materials Vol. 23, Iss. 5-6, pp. 252-256 (2021)