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Electrical properties of n-Si /Cu Schottky diodes formed by electrodeposition

M. AHMETOGLU (AFRAILOV)1,* , M. ALPER1, M. SAFAK1, K. ERTURK1, B. GURPINAR1, F. KOCAK1, C. HACIISMAILOGLU1

Affiliation

  1. Department of Physics, Uludag University, 16059, Görukle, Bursa, Turkey

Abstract

In this paper we report the electrical characteristics of the Schottky diodes formed by electrodeposition of copper on n- Si (111) from 0.2 M CuSO4 .5H2O + 0.5 M H3BO3 (pH=2.0) solution. Electrical measurements have been carried out at room temperature. n-Si /Cu diode current-voltage characteristics display low reverse- bias leakage currents and average barrier heights of 0.59 ± 0.02 eV and 0.67 ± 0.02 eV obtained from both I −V and C −V measurements at room temperature, respectively..

Keywords

Electrodeposition, Schottky diodes, Electrical properties.

Submitted at: Nov. 2, 2006
Accepted at: April 15, 2007

Citation

M. AHMETOGLU (AFRAILOV), M. ALPER, M. SAFAK, K. ERTURK, B. GURPINAR, F. KOCAK, C. HACIISMAILOGLU, Electrical properties of n-Si /Cu Schottky diodes formed by electrodeposition, Journal of Optoelectronics and Advanced Materials Vol. 9, Iss. 4, pp. 818-821 (2007)