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Reliability of adhesive bonded optical fiber array for photonic packaging

K.W. LAM1, M. A. UDDIN1, H. P. CHAN1,*

Affiliation

  1. Department of Electronic Engineering, City University of Hong Kong, Hong Kong

Abstract

In this paper, we investigated the environmental and mechanical reliability of adhesive based fiber array with reference to the Telcordia requirements. We found that the coefficient of thermal expansion (CTE) mismatch and surface contamination on the bonded surface were two critical causes for degradation in reliability of such components. Two types of adhesive with different CTE were used for assembling of fiber arrays to demonstrate the significant of these effects. By applying plasma cleaning technique to remove the surface contamination, we showed that the adhesion strength and consequently the reliability of fiber arrays were significantly improved..

Keywords

Fiber array, Reliability, Delamination, core pitch deviation, Coefficient of thermal expansion (CTE) mismatch, Surface contamination and adhesion strength.

Submitted at: June 9, 2008
Accepted at: Oct. 7, 2008

Citation

K.W. LAM, M. A. UDDIN, H. P. CHAN, Reliability of adhesive bonded optical fiber array for photonic packaging, Journal of Optoelectronics and Advanced Materials Vol. 10, Iss. 10, pp. 2539-2546 (2008)